Follow the recommended PCB land pattern and keep-out area to ensure proper coplanarity and solder joint strength.
Maintain clean, dust-free mating surfaces; avoid touching the gold contacts directly to prevent contamination and increased contact resistance.
Control reflow temperature profile within the connector material limits to avoid housing deformation.
Ensure sufficient mechanical support around the connector on the PCB for systems subject to shock or vibration.
When designing high-speed links, keep differential pairs length-matched and route away from strong EMI sources to preserve signal integrity.
