Product Description
This compact board-to-board SATA edge connector is designed for
high-density signal and low-voltage power transmission in storage
and embedded systems. The 1.27 mm pitch and 22-pin layout follow
common SATA interface practices, enabling reliable mating with
matching receptacles on HDD, SSD, or controller boards.
Copper-alloy contacts with gold-over-nickel plating provide low
contact resistance, corrosion resistance, and long-term signal
integrity. The right-angle SMT structure and gull-wing solder legs
allow automated reflow soldering and compact layout on densely
populated PCBs. The high-temperature, UL94V-0 housing ensures
mechanical stability during reflow and long-term operation in
demanding environments.
Customization is available for pin count, plating thickness, keying
features, and packaging (tape-and-reel or tray) to match different
server, automotive, or industrial PCB designs.
| Connector type | Board-to-board SATA edge connector, male, right-angle SMT |
| Pitch | 1.27 mm |
| Number of positions | 22 pins (signal + power options) |
| Mounting style | Surface-mount on PCB, gull-wing terminals |
| Contact material | Copper alloy, high conductivity |
| Contact plating | Gold over nickel on contact area, tin on solder tails |
| Housing material | High-temperature thermoplastic, UL94V-0 flame rating |
| Rated current | Up to 1.5 A per signal pin (higher on power pins depending on
design) |
| Rated voltage | Up to 30 V AC/DC (low-voltage signal and power lines) |
| Operating temperature | -40 °C to +105 °C (typical for SATA storage environments) |
| PCB suitability | Standard FR-4 PCB, recommended thickness around 1.6 mm |
| Compliance | RoHS, halogen-free options available on request |
Applications
SATA-based HDD and SSD storage devices
Server and data-center backplanes, RAID cards, NAS systems
Industrial PCs, embedded controllers, PLC and motion-control units
Communication equipment, routers, and network appliances requiring
compact storage interfaces
Test fixtures and adapter boards for drive evaluation and
mass-production testing
Precautions
Confirm the pitch, pin count, and footprint against your PCB layout
before mass production.
Keep total current and voltage within the specified ratings to
avoid overheating and contact damage.
During handling and assembly, avoid bending or twisting the SMT
terminals; use proper pick-and-place tooling.
Follow a suitable reflow soldering profile for high-temperature
thermoplastic housings to prevent warpage.
Ensure correct mating orientation with the corresponding SATA
connector to avoid mis-insertion and contact wear.
