This Micro-Fit 3.0 side-entry header is a 3.00 mm pitch, 2×3 pin male connector designed for compact power and signal transmission on printed circuit boards. The right-angle through-hole design allows horizontal mating to the PCB, saving vertical space in densely packed enclosures such as power supplies and control modules.

The housing is made from black glass-filled LCP with UL94-V0 flame rating and halogen-free formulation, providing excellent heat resistance and dimensional stability during wave or selective soldering. Copper-alloy terminals with 100 µ" minimum tin plating offer reliable solderability, low contact resistance and robust performance under vibration and thermal cycling.

With contact resistance ≤20 mΩ, insulation resistance ≥1,000 MΩ and 1500 VAC dielectric strength, this connector provides stable electrical performance for both low-voltage power rails and high-density signal lines. The 1.5 kgf minimum pin retention force after soldering ensures secure mechanical anchoring to the PCB, improving reliability in automotive and industrial environments.

Customization is available for pin count, plating, housing color and matching wire harness assemblies, enabling seamless integration with OEM designs or replacements for brands such as Tyco, Amphenol and other Micro-Fit-style systems.

⚙️ Applications

• PCB Signal & Data Transmission: Used for board-to-board or board-to-module connections, including low-voltage signals, data transmission, and control interfaces.
• Consumer Electronics: Common in smart home appliances, printers, cameras, displays, controllers, and handheld devices for internal signal routing.
• Industrial Automation & Control Systems: Applied in PLCs, industrial control boards, sensors, meters, robotics modules, and automation I/O interfaces.
• Servers & Data Center Equipment: Used for backplane interfaces, storage modules, communication boards, and signal expansion connectors.
• Automotive Electronics: Suitable for ECUs, BMS modules, sensor units, dashboards, infotainment systems, and on-board control interfaces.
• Communication & Networking Devices: Used in routers, switches, IoT gateways, RF modules, and network communication cards.
• IoT & Smart Device Modules: Applied in Bluetooth modules, WiFi modules, GPS/Beidou modules, sensor nodes, and embedded system expansion ports.
• Power Control & Monitoring Boards: For auxiliary power transmission, monitoring signals, and low-power control circuits.
• Custom OEM/ODM Electronic Designs: Ideal for designs requiring customizable pin count, pitch, height, plating option, and configuration.

⚠️ Notes

• Ensure Correct Pin Alignment: Check orientation and positioning before mating to avoid mis-insertion, bent pins, or PCB pad damage.
• Do Not Exceed Electrical Ratings: Follow the specified current and voltage limits to prevent overheating or contact failure.
• Proper Insertion and Extraction Force: Avoid excessive force during mating/unmating to prevent deformation, cracked solder joints, or pin damage.
• Keep Contact Surfaces Clean: Ensure terminals remain free from dust, oil, oxidation, or contaminants that reduce conductivity.
• Follow Recommended Soldering Conditions: Use appropriate soldering temperature profiles according to plastic materials such as LCP, PA6T, PA66, or PBT.
• Verify PCB Hole Tolerance: Incorrect hole size may cause inadequate solder filling or mechanical instability.
• Avoid Mechanical Stress After Assembly: Do not apply lateral pressure or bending forces, especially for SMT pin headers.
• Maintain Proper Storage Conditions: Store in a dry, dust-free environment to prevent terminal oxidation; use anti-static packaging if required.
• Confirm Compatibility with Female Header: Ensure matching pitch, pin count, height, and contact design to avoid mating failure.
• Choose Correct Plating Specification: Select proper plating (gold, tin, nickel) based on your application’s durability, corrosion resistance, and signal reliability needs.