This device is a Micro Fit 3.0 2×12 pin side-entry header connector developed for high-density power and signal routing on printed circuit boards. The 3.00 mm pitch dual-row layout offers 24 contacts in a compact footprint, ideal for modern automotive controllers, industrial drives and server power boards.

The housing is built from black glass-filled LCP with UL94-V0 flammability and halogen-free formulation, giving excellent heat resistance and dimensional stability through wave or selective soldering. Copper-alloy pins and fork-type side terminals are finished with nickel plus 100 μ" matte tin, ensuring strong solderability, low contact resistance and good corrosion resistance.

Electrical performance includes contact resistance ≤20 mΩ, insulation resistance ≥1,000 MΩ, and withstand voltage of 1500 VAC for one minute, providing reliable operation for DC rails and low-frequency signal lines. The 3.2 mm tail length gives robust solder joints and mechanical strength on standard or thicker PCBs, while the 1.5 kgf minimum pin retention after soldering helps the connector withstand vibration and impact.

We can provide OEM/ODM customization: different pin counts, plating systems, housing colors and complete wire harness sets to match your design or replace branded Micro-Fit style headers.

⚙️ Applications

• PCB Signal & Data Transmission: Used for board-to-board or board-to-module connections, including low-voltage signals, data transmission, and control interfaces.
• Consumer Electronics: Common in smart home appliances, printers, cameras, displays, controllers, and handheld devices for internal signal routing.
• Industrial Automation & Control Systems: Applied in PLCs, industrial control boards, sensors, meters, robotics modules, and automation I/O interfaces.
• Servers & Data Center Equipment: Used for backplane interfaces, storage modules, communication boards, and signal expansion connectors.
• Automotive Electronics: Suitable for ECUs, BMS modules, sensor units, dashboards, infotainment systems, and on-board control interfaces.
• Communication & Networking Devices: Used in routers, switches, IoT gateways, RF modules, and network communication cards.
• IoT & Smart Device Modules: Applied in Bluetooth modules, WiFi modules, GPS/Beidou modules, sensor nodes, and embedded system expansion ports.
• Power Control & Monitoring Boards: For auxiliary power transmission, monitoring signals, and low-power control circuits.
• Custom OEM/ODM Electronic Designs: Ideal for designs requiring customizable pin count, pitch, height, plating option, and configuration.

⚠️ Notes

• Ensure Correct Pin Alignment: Check orientation and positioning before mating to avoid mis-insertion, bent pins, or PCB pad damage.
• Do Not Exceed Electrical Ratings: Follow the specified current and voltage limits to prevent overheating or contact failure.
• Proper Insertion and Extraction Force: Avoid excessive force during mating/unmating to prevent deformation, cracked solder joints, or pin damage.
• Keep Contact Surfaces Clean: Ensure terminals remain free from dust, oil, oxidation, or contaminants that reduce conductivity.
• Follow Recommended Soldering Conditions: Use appropriate soldering temperature profiles according to plastic materials such as LCP, PA6T, PA66, or PBT.
• Verify PCB Hole Tolerance: Incorrect hole size may cause inadequate solder filling or mechanical instability.
• Avoid Mechanical Stress After Assembly: Do not apply lateral pressure or bending forces, especially for SMT pin headers.
• Maintain Proper Storage Conditions: Store in a dry, dust-free environment to prevent terminal oxidation; use anti-static packaging if required.
• Confirm Compatibility with Female Header: Ensure matching pitch, pin count, height, and contact design to avoid mating failure.
• Choose Correct Plating Specification: Select proper plating (gold, tin, nickel) based on your application’s durability, corrosion resistance, and signal reliability needs.