Verify that voltage and current in the application do not exceed the recommended ratings to avoid overheating or contact damage.
Follow the recommended PCB footprint and drill size for the pins and pegs to ensure stable mechanical retention and proper solder fillets.
Avoid excessive insertion or extraction force on mated harnesses; support the board mechanically if frequent mating cycles are expected.
Store and process the connectors in dry conditions; excessive moisture may affect solderability of the tin or gold-plated terminals.
