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Our SATA connector series is designed for stable data transmission
and high reliability. With customizable pin count, pitch,
materials, and plating specifications, we offer tailored solutions
for diverse applications. Produced in our automated facilities with
strict quality control, these connectors ensure excellent
durability, heat resistance, and hot-swap performance. Widely used
in computers, servers, and industrial storage devices, they deliver
precision connection and long-lasting performance.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
Notice: The displayed price is only for reference. Contact us now for the
best offer and detailed quotation!
This Micro-Fit 3.0 2×6 pin header connector is designed for
compact, high-current power and signal transmission on densely
populated PCBs.
Square copper-alloy pins with 50 μ" nickel and 100 μ" tin plating ensure low contact resistance, strong solderability and excellent
corrosion resistance after salt-spray testing. With up to 12.5 A per circuit at 250 V AC/DC, it easily supports low-voltage power rails and mixed signal lines
for modern electronics.
The vertical through-hole design with positioning peg provides
secure PCB anchoring and stable performance under vibration, cable
pull and repeated mating.
Glass-fiber-reinforced LCP housings rated UL94 V-0 and halogen-free withstand lead-free soldering profiles and harsh operating
temperatures from −40 °C to +105 °C. The 3.0 mm pitch is compatible
with many Micro-Fit-style footprints, enabling easy replacement or
second-source options in existing Tyco / Amphenol layouts.
Combined with IDC or crimped wire harnesses, this connector offers
a flexible, customized interconnection solution for power
distribution, control signals and data links.



| Product type | Micro-Fit 3.0 pin header connector (male) |
| Function | Wire-to-board electrical / electronic power & signal transmission |
| Series / pitch | Micro-Fit 3.0, 3.0 mm pitch |
| Positions | 2×6 pins (12 pins), dual row |
| Mounting style | Vertical through-hole PCB, with locating peg/post, external pin
length 2.6 mm |
| Terminal material | Copper alloy C1100 square pins |
| Plating | Ni 50 μ" min under-plating, matte Sn 100 μ" min on pins |
| Rated current | Up to 12.5 A per circuit (AWG16 wire) |
| Rated voltage | 250 V AC / DC |
| Contact resistance | ≤ 20 mΩ max |
| Insulation resistance | ≥ 1000 MΩ min |
| Dielectric withstand | 1500 V AC / minute |
| Salt-spray test | 24 h |
| Operating temperature | −40 °C to +105 °C |
| Pin retention force | ≥ 1.5 Kgf per pin before & after reflow |
| Housing material | LCP E130I black, G/F reinforced, UL94 V-0, HF |
| Cap / insulator | LCP black G/F, UL94 V-0 |
| Environmental | Halogen-free, RoHS-compliant |
| Typical mating | Micro-Fit 3.0 female housing & crimp terminals / custom IDC wire
harness |
⚙️ Applications
- PCB Signal & Data Transmission: Used for board-to-board or board-to-module connections, including
low-voltage signals, data transmission, and control interfaces.
- Consumer Electronics: Common in smart home appliances, printers, cameras, displays,
controllers, and handheld devices for internal signal routing.
- Industrial Automation & Control Systems: Applied in PLCs, industrial control boards, sensors, meters,
robotics modules, and automation I/O interfaces.
- Servers & Data Center Equipment: Used for backplane interfaces, storage modules, communication
boards, and signal expansion connectors.
- Automotive Electronics: Suitable for ECUs, BMS modules, sensor units, dashboards,
infotainment systems, and on-board control interfaces.
- Communication & Networking Devices: Used in routers, switches, IoT gateways, RF modules, and network
communication cards.
- IoT & Smart Device Modules: Applied in Bluetooth modules, WiFi modules, GPS/Beidou modules,
sensor nodes, and embedded system expansion ports.
- Power Control & Monitoring Boards: For auxiliary power transmission, monitoring signals, and
low-power control circuits.
- Custom OEM/ODM Electronic Designs: Ideal for designs requiring customizable pin count, pitch, height, plating option, and configuration.
⚠️ Notes
- Ensure Correct Pin Alignment: Check orientation and positioning before mating to avoid
mis-insertion, bent pins, or PCB pad damage.
- Do Not Exceed Electrical Ratings: Follow the specified current and voltage limits to prevent
overheating or contact failure.
- Proper Insertion and Extraction Force: Avoid excessive force during mating/unmating to prevent
deformation, cracked solder joints, or pin damage.
- Keep Contact Surfaces Clean: Ensure terminals remain free from dust, oil, oxidation, or
contaminants that reduce conductivity.
- Follow Recommended Soldering Conditions: Use appropriate soldering temperature profiles according to
plastic materials such as LCP, PA6T, PA66, or PBT.
- Verify PCB Hole Tolerance: Incorrect hole size may cause inadequate solder filling or
mechanical instability.
- Avoid Mechanical Stress After Assembly: Do not apply lateral pressure or bending forces, especially for
SMT pin headers.
- Maintain Proper Storage Conditions: Store in a dry, dust-free environment to prevent terminal
oxidation; use anti-static packaging if required.
- Confirm Compatibility with Female Header: Ensure matching pitch, pin count, height, and contact design to
avoid mating failure.
- Choose Correct Plating Specification: Select proper plating (gold, tin, nickel) based on your
application’s durability, corrosion resistance, and signal
reliability needs.