Our SATA connector series is designed for stable data transmission
and high reliability. With customizable pin count, pitch,
materials, and plating specifications, we offer tailored solutions
for diverse applications. Produced in our automated facilities with
strict quality control, these connectors ensure excellent
durability, heat resistance, and hot-swap performance. Widely used
in computers, servers, and industrial storage devices, they deliver
precision connection and long-lasting performance.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
Notice: The displayed price is only for reference. Contact us now for the
best offer and detailed quotation!
This Micro-Fit 3.0 2×4 pin header connector provides high-density,
high-current power and signal transmission in a compact PCB
footprint.
Heavy-duty copper-alloy square pins with 50 μ" Ni and 100 μ" Sn plating deliver low contact resistance, excellent solderability and
long-term corrosion resistance. With up to 12.5 A per circuit at 250 V AC/DC, the connector is ideal for both low-voltage power rails and mixed
signal lines on compact boards.
The vertical through-hole design with locating peg ensures secure
PCB retention and stable performance under vibration and cable
stress.
Glass-fiber-reinforced LCP housings rated UL94 V-0 and halogen-free withstand lead-free soldering temperatures and harsh operating
environments from −40 °C to +105 °C. The 3.0 mm pitch matches
common Micro-Fit / power header footprints and can be paired with
IDC, crimp or over-molded wire harnesses for flexible system
integration.
This connector can be used as an alternative to Micro-Fit-style
solutions from major brands (e.g. Tyco, Amphenol) in many PCB
layouts, RJ45 interface boards or IDC harness backplanes, without
changing the overall application concept.
| Product type | Micro-Fit 3.0 pin header connector (male) |
| Function | Wire-to-board electrical / electronic power & signal transmission |
| Pitch | 3.0 mm |
| Positions | 2×4 pins (8 pins), dual row |
| Mounting style | Vertical, through-hole PCB, with positioning peg/post |
| Tail length | Approx. 2.6 mm pin protrusion |
| Terminal material | Copper alloy C1100 square pins |
| Plating | Ni 50 μ" min under-plating, matte Sn 100 μ" min on pins |
| Rated current | Up to 12.5 A per circuit (AWG16) |
| Rated voltage | 250 V AC / DC |
| Contact resistance | ≤ 20 mΩ max |
| Insulation resistance | ≥ 1000 MΩ min |
| Dielectric withstand | 1500 V AC / minute |
| Salt-spray test | 24 h |
| Operating temperature | −40 °C to +105 °C |
| Pin retention force | ≥ 1.5 Kgf per pin before & after reflow |
| Housing material | LCP E130I black, G/F reinforced, UL94 V-0, HF |
| Cap / insulator | LCP black G/F, UL94 V-0 |
| Environmental | Halogen-free, RoHS-compliant |
| Typical mating | Micro-Fit 3.0 female housing & crimp terminals, custom IDC / wire
harness |
| Brand compatibility | Alternative solution for Micro-Fit-style connectors used with Tyco, Amphenol, RJ45 interface boards, IDC cable assemblies |
⚙️ Applications
- PCB Signal & Data Transmission: Used for board-to-board or board-to-module connections, including
low-voltage signals, data transmission, and control interfaces.
- Consumer Electronics: Common in smart home appliances, printers, cameras, displays,
controllers, and handheld devices for internal signal routing.
- Industrial Automation & Control Systems: Applied in PLCs, industrial control boards, sensors, meters,
robotics modules, and automation I/O interfaces.
- Servers & Data Center Equipment: Used for backplane interfaces, storage modules, communication
boards, and signal expansion connectors.
- Automotive Electronics: Suitable for ECUs, BMS modules, sensor units, dashboards,
infotainment systems, and on-board control interfaces.
- Communication & Networking Devices: Used in routers, switches, IoT gateways, RF modules, and network
communication cards.
- IoT & Smart Device Modules: Applied in Bluetooth modules, WiFi modules, GPS/Beidou modules,
sensor nodes, and embedded system expansion ports.
- Power Control & Monitoring Boards: For auxiliary power transmission, monitoring signals, and
low-power control circuits.
- Custom OEM/ODM Electronic Designs: Ideal for designs requiring customizable pin count, pitch, height, plating option, and configuration.
⚠️ Notes
- Ensure Correct Pin Alignment: Check orientation and positioning before mating to avoid
mis-insertion, bent pins, or PCB pad damage.
- Do Not Exceed Electrical Ratings: Follow the specified current and voltage limits to prevent
overheating or contact failure.
- Proper Insertion and Extraction Force: Avoid excessive force during mating/unmating to prevent
deformation, cracked solder joints, or pin damage.
- Keep Contact Surfaces Clean: Ensure terminals remain free from dust, oil, oxidation, or
contaminants that reduce conductivity.
- Follow Recommended Soldering Conditions: Use appropriate soldering temperature profiles according to
plastic materials such as LCP, PA6T, PA66, or PBT.
- Verify PCB Hole Tolerance: Incorrect hole size may cause inadequate solder filling or
mechanical instability.
- Avoid Mechanical Stress After Assembly: Do not apply lateral pressure or bending forces, especially for
SMT pin headers.
- Maintain Proper Storage Conditions: Store in a dry, dust-free environment to prevent terminal
oxidation; use anti-static packaging if required.
- Confirm Compatibility with Female Header: Ensure matching pitch, pin count, height, and contact design to
avoid mating failure.
- Choose Correct Plating Specification: Select proper plating (gold, tin, nickel) based on your
application’s durability, corrosion resistance, and signal
reliability needs.
